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Shenzhen Refond Optoelectronics Co., Ltd(Stock Code: 300241) is the world's well-known LED packaging solutions and opto semiconductor supplier, which covers the research and development as well as production of LED light sources and provides application solutions for Micro LED display, AI sensor, general lighting, etc.
Refond was founded in 2000 with scientific and technological innovation, technology leadership, and product differentiation, which are the core competitiveness of our company. Refond has established deep business and strategic partnerships with the world's first-tier brands. At present, Refond focuses on Mini LED, Micro LED, AI sensor devices and other areas of research and development and business layout, to enhance the company's core competitiveness and sustainable profitability.
During years of development and accumulation, Refond has helped customers in various industries and meet the needs of present and future social development with scientific and technological innovation. In the future, Refond Optoelectronics will continue to practice the brief of "enriching human life with innovation and technology", integrating global resources with technology, promoting innovation and development. Over 20 years, Refond is committed to realizing the corporate vision of "the world's leading technology company".



Corporate Mission: Innovation enriches life.
Corporate Vision: Become the world's leading technology company






The core value of

The development course

2022

2021

2020

2019

2018

2016

2015

2014

2013

2012

2011

2010

2009

2006

2005

2004

2002

2000

2022

-Refond RGB 1415 gold wire lighted up the large snowflake at Winter Olympics in Beijing.
-Helped TCL launch Mini LED backlight terminal product.
-The headquaters building was put into use.
-Hubei subsidiary’s Mini LED industrial base construction finished and start mass production.
-Phosphor deposition technology.

    
2021

-Micro Lens technology, CSP backlight leveling technology, Demura technology, bottom polish technology and ultra-thin molding technology.
-Founded wholly-owned Hubei subsidiary.
-Construction of Hubei subsidiary’s MINI LED industrial base started up.
-Mini LED backlight terminal products were launched.
-Approved by Valeo and into its supplying systerm.





2020

- Gold capping of Rui Fung Building

- The whole line of Special lighting Business Unit was relocated to Yiwu production base

- The first batch of MINI LED production line enterprises in China

- The backlight series covers VR/PAD/NB/NMT/TV and other full lines of mass production

- Direct display series P0.49 and above capacity expansion, quantity received orders

- P0.39 delivered in small batches

2019

-Top 70 Innovative enterprises in Shenzhen.

-Partial backlight series, P0.49 of direct display series and P0.39 samples were delivered.




2018

-Approved as Guangdong LED backlight TV engineering technology research center.
-Mini-LED P0.68 new display technology realizes mass production.
-Promoted SMC LED.


2016

-Founded wholly-owned Zhejiang subsidiary.

-Started to establish Yiwu industrial park. 

-Obtained GE KSF phosphor application patent authorization.

-Obtained first prize and second prize of national technical invention.

-Flip-Chip Stand 3D Packaging Technology FEMC won the first and second prizes of National technology Invention. 






2015

- Acquisition of Lingtao Optoelectronics

- Obtained CNAS National Laboratory certification

-Approved Shenzhen LED TV Backlight Engineering Technology Research and Development Center

- Obtained the patent authorization of TOYODA GOSEI White Light

2014

- CSP patents, technologies and product solutions

- Inorganic packaging technology and product solutions

- Introduction of EMC LED

2013

- Mass production application of high-power LED eutectic welding technology

- Full light packaging technology and filament

2012

- High power LED phosphor KL graphic coating

- Launch of PCT TOP LED

2011

- Listing on chinext

- Launch TOP LED4014, 7020

2010

- LED large size backlight overall solution and products

- High-power LED packaging phosphor coating technology optimization, lens integrated molding technology

2009

- Solid technology optimization, the first launch of 30Ma driven TOP LED

2006

- Silver glue Ohmic touch bottom line protection patents and technology

- Established a cooperative relationship with Matsushita

2005

- OEM/ODM partner of Broadcom

- Ceramic high-power LED packaging technology, patents and products

2004

- Awarded as a high-tech enterprise

-Establish cooperative relationship with ABB, an internationally renowned enterprise


2002

- First SMD LED package wire

2000

- Company Establishment

Research and development ability

The future development

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