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Company Profile

Refond Optoelectronics Co., Ltd. (stock code: 300241) is a world-renowned innovative technology company that integrates R&D, production and sales of LED and LED application solutions.

Innovation, leading technology and product differentiation are the core competitiveness of Refond Optoelectronics. Refond Optoelectronics has successively laid out and promoted the development of lighting, display, automotive, electrical and other professional fields, and has established in-depth business and strategic cooperative relations with global first-line brand enterprises. At present, the company will focus on R&D and business layout in emerging fields such as Mini LED, Micro LED and AI sensor devices, so as to enhance the company's core competitiveness and sustainable profitability.

Founded in 2000, scientific research and innovation have brought inexhaustible power to Refond's development. Refond Optoelectronics is committed to helping customers in various industries meet the needs of today's and future social development. In the future, Refond Optoelectronics will continue to adhere to the concept of "innovating science and technology to enrich human life", integrate global resources and technologies, keep innovating and developing, and take "becoming the world's leading science and technology company" as its corporate vision.


Corporate Mission: Innovation enriches life.
Corporate Vision: Become the world's leading technology company

Principles

Development Course

2022

2021

2020

2019

2018

2016

2015

2014

2013

2012

2011

2010

2009

2006

2005

2004

2002

2000

2022

- Refond RGB lights up the Beijing Winter Olympics snowflake

- Refond helped TCL release Mini LED backlight terminal products

- Refond Optoelectronics headquarters building put into use

- Hubei Ruihua Mini LED Industrial Park was completed and put into operation

- Phosphor deposition technology


2021

-Micro Lens technology, CSP backlight leveling technology, Demura technology, bottom polish technology and ultra-thin molding technology.


-Founded wholly-owned Hubei subsidiary.


-Construction of Hubei subsidiary’s MINI LED industrial base started up.


-Mini LED backlight terminal products were launched.


-Approved by Valeo and into its supplying systerm.





2020

- Gold capping of Refond Headquarters Building


- The whole line of Special lighting Business Unit was relocated to Yiwu production base


- The first batch of MINI LED production line enterprises in China


- The backlight series covers VR/PAD/NB/NMT/TV and other full lines of mass production


- Direct display series P0.49 and above capacity expansion, quantity received orders


- P0.39 delivered in small batches

2019

-Top 70 Innovative enterprises in Shenzhen.

-Partial backlight series, P0.49 of direct display series and P0.39 samples were delivered.




2018


-Approved as Guangdong LED backlight TV engineering technology research center.


-Mini-LED P0.68 new display technology realizes mass production.


-Promoted SMC LED.



2016

-Founded wholly-owned Zhejiang subsidiary.

-Started to establish Yiwu industrial park. 

-Obtained GE KSF phosphor application patent authorization.

-Obtained first prize and second prize of national technical invention.

-Flip-Chip Stand 3D Packaging Technology FEMC won the first and second prizes of National technology Invention. 






2015

- Acquisition of Lingtao Optoelectronics

- Obtained CNAS National Laboratory certification

-Approved Shenzhen LED TV Backlight Engineering Technology Research and Development Center

- Obtained the patent authorization of TOYODA GOSEI White Light

2014

- CSP patents, technologies and product solutions

- Inorganic packaging technology and product solutions

- Introduction of EMC LED

2013

- Mass production application of high-power LED eutectic welding technology

- Full light packaging technology and filament

2012

- High power LED phosphor KL graphic coating

- Launch of PCT TOP LED

2011

- Listing on chinext

- Launch TOP LED4014, 7020

2010

- LED large size backlight overall solution and products

- High-power LED packaging phosphor coating technology optimization, lens integrated molding technology

2009

- Solid technology optimization, the first launch of 30Ma driven TOP LED

2006

- Silver glue Ohmic touch bottom line protection patents and technology

- Established a cooperative relationship with Matsushita

2005

- OEM/ODM partner of Broadcom

- Ceramic high-power LED packaging technology, patents and products

2004

- Awarded as a high-tech enterprise

-Establish cooperative relationship with ABB, an internationally renowned enterprise


2002

- First SMD LED package wire

2000

- Company Establishment

Research & Development Ability

Future Development

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