Features

- 1000lm/M, void rate <10%, L70≥15000H, no dead light in twist test;

- COB integrated package, no dots, more uniform light and color;

- Flexible and bendable, suitable for different scenarios and structural designs;

- Freely cut and spliced, the minimum size is 62.5mm, the maximum size is 5m;

- Small package size and light emitting surface , the application field is wide;

- Flip chip packaging leads to excellent reliability;

- Unique serial and parallel structure design, double guarantee of craftsmanship and quality;

- widely used in showcase, home, restaurant etc.