Be guided by purpose

Technical Path

2002  Established the first domestic SMD LED packaging lines

2005  Approved high power ceramic led patent, package technology and package product

2006  DA-epoxy ohmic contact bottom line protection technology and patent

2009  TOP LED. Technology improvement of die bounding, Refond was the first to promote the 30mA driven TOP LED

2010 LED TV backlight overall solution and products; High power package phosphor coating technology improvement and lens molding technology

2011  Promoted TOP LED 4014, 7020

2012  High power LED phosphor KL graphical coating; Promoted PCT TOP LED

2013  High power LED eutectic bonding technology MP application

2013  360°emitting package and filament product

2014  CSP patent, technology and product solution; Inorganic package technology and product solution, EMC LED MP

2015  Refond laboratory got CNAS certification

2016  Flip chip on board 3D package technology awarded the first and second prize in national technical inventions.

2017  Micro lens production technology and package application solution