mini led display

In recent years, with the development of ultra-small spacing display technology such as Mini/Micro LED, the market pattern is slowly changing. In the field of ultra-small spacing (≤P1.25) display, display manufacturers at home and abroad have launched products with P0.9~P1.25 spacing, actively layout the field of ultra-small spacing display. Even many traditional panel manufacturers have actively joined in the business war of "competing for future discourse power", and have developed and launched relevant products and opened up channels to seize the market by means of capital and technology.

However, as the Pitch is gradually reduced, for the traditional SMD packaging form, the processing accuracy and process difficulty are increased due to the small size of the single LED device. Limited by the accuracy level of the existing equipment and supporting devices, it is unable to meet the realization of products with smaller Pitch.

Compared with traditional SMD packaging, full-flip Mini COB packaging has many advantages, which can effectively avoid the problem of bad points caused by humidity, static electricity and other environmental factors or human factors in traditional SMD packaging. Uniform luminescence, approximate surface light source, can effectively eliminate mores, reduce glare and dazzling sense; Compared with the traditional SMD package through four solder joints heat dissipation, fully inverted Mini COB Chip directly mounted on the PCB, directly through the PCB heat dissipation, better heat dissipation effect; Compared with the traditional SMD packaging, the Chip with fully flip Mini COB is directly mounted on the PCB, which reduces the failure factor of bond line eutectic and improves the reliability. Full flip Mini COB technology eliminates SMD bracket and SMT reflow welding link, with no risk of fake welding and higher reliability. Full flip COB does surface protection, which can withstand greater external force, so it can reduce the cost of subsequent damage and maintenance.

Compared with other manufacturers, Refond in addition to having 20 years of packaging experience, in the field of full flip technology is early intervention, invested in a large number of research and development; In 2016, we began to cooperate with domestic and foreign key customers to develop MiniLED related products; At the end of 2017, Refond built the first Mini LED automatic production line in China. We have developed ultra-small spacing products such as P0.9 and P0.6 and ultra-small spacing products such as P0.4 and P0.3, and cooperated with customers to participate in industry exhibitions for many times.

Mini direct display products

Refond Mini direct display products are divided into two series of products:

The first product series: COB module series, which covers modules, boxes and overall solutions;

Screen body control system scheme configuration diagram